• Anglický jazyk

Direct Copper Interconnection for Advanced Semiconductor Technology

Autor: Dongkai Shangguan

In the "More than Moore" era, performance requirements for leading edge semiconductor devices are demanding extremely fine pitch interconnection in semiconductor packaging.

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208.80 €

bežná cena: 232.00 €

O knihe

In the "More than Moore" era, performance requirements for leading edge semiconductor devices are demanding extremely fine pitch interconnection in semiconductor packaging.

  • Vydavateľstvo: CRC Press
  • Rok vydania: 2024
  • Formát: Hardback
  • Rozmer: 240 x 161 mm
  • Jazyk: Anglický jazyk
  • ISBN: 9781032528236

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