- Anglický jazyk
Direct Copper Interconnection for Advanced Semiconductor Technology
Autor: Dongkai Shangguan
In the "More than Moore" era, performance requirements for leading edge semiconductor devices are demanding extremely fine pitch interconnection in semiconductor packaging.
Viac o kniheNa objednávku
208.80 €
bežná cena: 232.00 €
O knihe
In the "More than Moore" era, performance requirements for leading edge semiconductor devices are demanding extremely fine pitch interconnection in semiconductor packaging.
- Vydavateľstvo: CRC Press
- Rok vydania: 2024
- Formát: Hardback
- Rozmer: 240 x 161 mm
- Jazyk: Anglický jazyk
- ISBN: 9781032528236