• Anglický jazyk

Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments

Autor: Juan Cepeda-Rizo

Na objednávku

67.59 €

bežná cena: 75.10 €

O knihe

This book provides useful and practical approaches to solving the most complex thermal-structural problems ever attempted for design spacecraft to survive the severe cold of deep space, as well as the unforgiving temperature swings on the surface of Mars.

  • Vydavateľstvo: CRC Press
  • Rok vydania: 2024
  • Formát: Paperback
  • Rozmer: 234 x 156 mm
  • Jazyk: Anglický jazyk
  • ISBN: 9781032160856

Generuje redakčný systém BUXUS CMS spoločnosti ui42.