- Anglický jazyk
Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments
Autor: Juan Cepeda-Rizo
Na objednávku
67.59 €
bežná cena: 75.10 €
O knihe
This book provides useful and practical approaches to solving the most complex thermal-structural problems ever attempted for design spacecraft to survive the severe cold of deep space, as well as the unforgiving temperature swings on the surface of Mars.
- Vydavateľstvo: CRC Press
- Rok vydania: 2024
- Formát: Paperback
- Rozmer: 234 x 156 mm
- Jazyk: Anglický jazyk
- ISBN: 9781032160856