- Anglický jazyk
Thermal Management Materials for Electronic Packaging
Autor: Xingyou Tian
Summarizes the development of thermal management materials and introduces the preparation methods and application scenarios of thermal management materials for electronic packing.
Viac o kniheNa objednávku
137.88 €
bežná cena: 153.20 €
O knihe
Summarizes the development of thermal management materials and introduces the preparation methods and application scenarios of thermal management materials for electronic packing.
- Vydavateľstvo: Wiley-VCH GmbH
- Rok vydania: 2024
- Formát: Hardback
- Rozmer: 246 x 171 mm
- Jazyk: Anglický jazyk
- ISBN: 9783527352425