• Anglický jazyk

Thermal Management Materials for Electronic Packaging

Autor: Xingyou Tian

Summarizes the development of thermal management materials and introduces the preparation methods and application scenarios of thermal management materials for electronic packing.

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137.88 €

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O knihe

Summarizes the development of thermal management materials and introduces the preparation methods and application scenarios of thermal management materials for electronic packing.

  • Vydavateľstvo: Wiley-VCH GmbH
  • Rok vydania: 2024
  • Formát: Hardback
  • Rozmer: 246 x 171 mm
  • Jazyk: Anglický jazyk
  • ISBN: 9783527352425

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