• Anglický jazyk

Design-for-Test and Test Optimization Techniques for TSV-based 3D Stacked ICs

Autor: Krishnendu Chakrabarty

This book describes innovative techniques to address the testing needs of 3D stacked integrated circuits (ICs) that utilize through-silicon-vias (TSVs) as vertical interconnects. The authors identify the key challenges facing 3D IC testing and present results... Viac o knihe

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O knihe

This book describes innovative techniques to address the testing needs of 3D stacked integrated circuits (ICs) that utilize through-silicon-vias (TSVs) as vertical interconnects. The authors identify the key challenges facing 3D IC testing and present results that have emerged from cutting-edge research in this domain. Coverage includes topics ranging from die-level wrappers, self-test circuits, and TSV probing to test-architecture design, test scheduling, and optimization. Readers will benefit from an in-depth look at test-technology solutions that are needed to make 3D ICs a reality and commercially viable.

  • Vydavateľstvo: Springer International Publishing
  • Rok vydania: 2013
  • Formát: Hardback
  • Rozmer: 241 x 160 mm
  • Jazyk: Anglický jazyk
  • ISBN: 9783319023779

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