• Anglický jazyk

Packaging of High Power Semiconductor Lasers

Autor: Xingsheng Liu

This book introduces high power semiconductor laser packaging design. The challenges of the design and various packaging and testing techniques are detailed by the authors. New technologies and current applications are described in detail.

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O knihe

This book introduces high power semiconductor laser packaging design. The challenges of the design and various packaging and testing techniques are detailed by the authors. New technologies and current applications are described in detail.

  • Vydavateľstvo: Springer New York
  • Rok vydania: 2016
  • Formát: Paperback
  • Rozmer: 235 x 155 mm
  • Jazyk: Anglický jazyk
  • ISBN: 9781493955909

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