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Anglický jazyk
Three-Dimensional Integration of Semiconductors
Autor: Kazuo Kondo
This book starts with background concerning three-dimensional integration - including their low energy consumption and high speed image processing - and then proceeds to how to construct them and which materials to use in particular situations. The book... Viac o knihe
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148.49 €
bežná cena: 164.99 €
O knihe
This book starts with background concerning three-dimensional integration - including their low energy consumption and high speed image processing - and then proceeds to how to construct them and which materials to use in particular situations. The book covers numerous applications, including next generation smart phones, driving assistance systems, capsule endoscopes, homing missiles, and many others. The book concludes with recent progress and developments in three dimensional packaging, as well as future prospects.
- Vydavateľstvo: Springer International Publishing
- Rok vydania: 2019
- Formát: Paperback
- Rozmer: 235 x 155 mm
- Jazyk: Anglický jazyk
- ISBN: 9783319792552
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